Sapphire wafer
 2 inch sapphire wafer specification
 Description  Specification
 Material

 Al2O3

 Wafer Surface Orientation  C-Plane off Angle 0.2° ± 0.1° to M Axis
 C-Plane off Angle 0° ± 0.1° to Axis
 Primary Flat Orientation

 A-Plane± 0.3°

 Primary Flat Length

 16.0mm± 1.0 mm

 Secondary Flat  N/A
 Diameter  50.8±0.20 mm
 Thickness  430±15 um
 BOW  0∼-8 um
 TTV  ≦5 um
 Front Surface Roughness

 ≦3 Å

 Back Surface Roughness  0.8~1.2 um
 1.0∼1.4 um
 Chips  3 x < 0.2 mm (max.)
 Cleanliness  ready for EPI
 Packaging  Cassettes of 25pcs,無塵室1000 級/包裝區100 級
** 每盒shipping box 內晶圓厚度需在3um 範圍內
 
 4 inch sapphire wafer specification
 Description  Specification
 Material

 Mono-crystalline Synthetic Sapphire (Al2O3)

 Wafer Surface Orientation  C-Plane off Angle 0.2° ± 0.1° to M Axis
 C-Plane off Angle 0° ± 0.1° to Axis
 Primary Flat Orientation

 0.0± 0.3°

 Primary Flat Length

 31mm± 1.0 mm

 Secondary Flat  N/A
 Diameter  100±0.25 mm
 Thickness  650±25 um
 BOW  0+/-20 um
 TTV  ≦15 um
 Front Surface Roughness

 ≦3 Å

 Back Surface Roughness  0.8~1.2 um
 Cleanliness  ready for EPI
 Packaging  Cassettes of  25pcs,無塵室1000 級/包裝區100 級
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低溫固化黏著膠材
 
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sapphire wafer
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光電材料
 
蝕刻膏
    ITO(氧化銦錫) 蝕刻膏
    SiO2 (氧化矽) 蝕刻膏
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    IZO(氧化銦鋅) 蝕刻膏
 
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聯絡我們
 
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相關連結
 
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益銓國際有限公司 Yia Chuan International Co., Ltd. 1F,No.147,Hsichou St., Chungli City, Taoyuan County , Taiwan
Tel:+886-3-4521569  •Fax:+886-3-4519810 E-mail:service@ycicorp.com.tw