Mono-Crystalline
Item
Uint
125 x 125
156 x 156
Crystal Growth Method
CZ
CZ
Crystal Orientation
±3 Degree
(100)
(100)
Conductivity Type
P
P
Dopant
Boron
Boron
Resistivity
Ω-cm
0.5 ~ 6
0.5 ~ 6
Diagonal
±1
150
200
Geometry Dimension
Square ±0.5 mm
125 x 125
156 x 156
Thickness
±30 μm
220±30
240±30
 
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Multi- Crystalline
Item
Uint
125 x 125
156 x 156
Crystal Growth Method
CZ
CZ
Crystal Orientation
±3 Degree
(100)
(100)
Conductivity Type
P
P
Dopant
Boron
Boron
Resistivity
Ω-cm
0.5 ~ 6
0.5 ~ 6
Diagonal
±1
150
200
Geometry Dimension
Square ±0.5 mm
125 x 125
156 x 156
Thickness
±30 μm
220±30
240±30
  WE have our own processing line with ability forStripping Dice, Broken Wafer,
Broken Solar Cell, and Broken Solar Wafer .
   
電子/微機電封裝 低溫固化黏著膠材
 
低溫固化黏著膠材
 
MEMS(微機電)封裝低溫固化膠材
 
膠材包裝
...............................................................
半導體專用矽晶圓
 
Dummy Wafer
 
Silicon Wafer
 
Solar Wafer
 
Mechanical Wafer
 
Silicon Material
 
Wafer Carrier
 
Aluminium Coated Wafer
 
Oxide coated Wafer
 
Optics Coating Substrate Wafer
 
sapphire wafer
...............................................................
光電材料
 
蝕刻膏
    ITO(氧化銦錫) 蝕刻膏
    SiO2 (氧化矽) 蝕刻膏
    Cu   ( 銅 )  蝕刻膏
    IZO(氧化銦鋅) 蝕刻膏
 
OCA 膠去除劑
 
Glass paste ( 玻璃膏 )
...............................................................
聯絡我們
 
聯絡我們
...............................................................
相關連結
 
相關連結
 
益銓國際有限公司 Yia Chuan International Co., Ltd. 1F,No.147,Hsichou St., Chungli City, Taoyuan County , Taiwan
Tel:+886-3-4521569  •Fax:+886-3-4519810 E-mail:service@ycicorp.com.tw